All press releases

More than 300 contributions: conference program for PCIM Europe 2020 is announced

Feb 10, 2020

Parallel to the PCIM Europe exhibition, the conference held from 5 – 7 May 2020 in Nuremberg, offers a multi-faceted program consisting of lecture and poster presentations, keynotes, special sessions and exclusive seminars and tutorials.

ICurrent research is focused on the applications of wide bandgap technologies at component and chip level, in packaging and interconnection technologies and packaging design. Technical advances in silicon carbide (SiC) and gallium nitride (GaN) devices have also made it possible to create power electronic converters and evaluate the tremendous advantages of using them in systems. A major part of the PCIM Europe Conference 2020 will be dedicated to the latest innovations, in particular those relating to the robustness of devices and reliability of systems as well as their excellent overload and short-circuit behavior. Future packaging designs featuring extremely low leakage inductance to control ultra-fast switching times will be discussed. Experts from science and industry will present the latest findings on new materials that combine modified thermal expansion coefficients with very good thermal management to extend the service life of devices. Innovative system solutions with intelligent control concepts for managing high di/dt and du/dt values will also be on show. The program includes the following presentations:

  • “3.3kV All SiC Module with 1st Generation Trench Gate SiC MOSFETs for Traction Inverters” by Yusuke Sekino et al, Fuji Electric, Japan
  • “dV/dt Control Methods for United SiC FETs with Internal Cascode Structure” by Zhongda Li et al, United Silicon Carbide, USA
  • “Experimental Evaluation and Analysis of Dynamic On-Resistance in Hard- and Soft-Switching Operation of a GaN GIT” by Xiaomeng Geng et al, TU Berlin, Germany

A further highlight of the PCIM Conference 2020 will be system designs with new low-inductance package designs, chip interface technologies for extended temperature ranges, and multi-ceramic substrate materials with integrated cooling for chips with high power density and extremely fast switching operations. A major goal of these module variants is to achieve significantly higher load cycles and provide new materials for highly effective heat dissipation combined with high insulation strength. Especially when using SiC components with higher dielectric strength, important questions arise regarding possible lead applications and system advantages and their intersection with economic efficiency. These and other questions will be discussed during the conference. Experts will share their knowledge in the following contributions:

  • “An Economic Evaluation of SiC-MOSFET Modules in Wind Turbine Converters” by Robin Schmidtke et al, University of Rostock, Germany
  • “Advantages and Challenges of Using SiC MOSFETs in a High Power Density Insulated HV/LV DC-DC Converter” by Stephan Zeltner et al, Fraunhofer IISB, Germany
  • “Monolithic GaN Inverter Experimental Investigations” by Dominique Bergogne et al, CEA-Tech Grenoble, France
  • “Power Cycle Lifetime of Over 320,000 Cycles at Tjmax = 200°C Realized by a Fatigue-Free Chip Top Structure” by Hiroshi Notsu et al, AIST, Japan

Interested participants can also obtain comprehensive information about the intelligent management of energy storage systems. Special attention will be given to discussing and evaluating system-relevant electrical functions, sensors for monitoring the state of charge and aging of individual battery cells, and optimized charging strategies designed to extend battery life.

For the first time, the PCIM Europe Conference will offer a special session on the additive manufacturing of components. These 3D-printed components are used, among other things, as integrated heat sinks in the automotive industry. Three further special sessions will focus on the topics of “Reliability and Safety of Energy Storage Systems,” “Battery Management in Automotive Applications,” and “Rail Traction Power Supplies”.

As well as a keynote presentation on “Electric Cars,” attendees to the conference can also look forward to two more keynote presentations on “Battery Energy Storage Systems: Past, Present and Future” by Ahmed Elasser from the GE Global Research Center in the USA and “Innovative Data Centers Power Infrastructure Solutions” by Roland Hümpfner from Huawei Technologies in Germany.

“This year’s PCIM Europe Conference features outstanding presentations on key developments in power electronics,” states Professor Leo Lorenz, General Conference Director of PCIM Europe. These developments include aspects of future system development for energy storage systems and new approaches for producing power electronic components using additive manufacturing techniques.

Sign up and benefit from attractive early-bird rates

You can register for the PCIM Europe Conference at Attractive early-bird rates are available until 12 March 2020.

You can find out more about the PCIM Europe Conference at  

Über 300 Beiträge: PCIM Europe 2020 Konferenzprogramm veröffentlicht
Conferenece PCIM Europe 2019

About Mesago Messe Frankfurt
Mesago, founded in 1982 and located in Stuttgart, specializes in exhibitions and conferences on various topics of technology. The company belongs to the Messe Frankfurt Group. Mesago operates internationally and is not tied to a specific venue. With 160 members of staff Mesago organizes events for the benefit of more than 3,300 exhibitors and over 110,000 trade visitors, conference delegates and speakers from all over the world. Numerous trade associations, publishing houses, scientific institutes and universities work with Mesago closely as advisers, co-organizers and partners. (

Background information on Messe Frankfurt
Messe Frankfurt is the world’s largest trade fair, congress and event organiser with its own exhibition grounds. With more than 2,500 employees at 30 locations, the company generates annual sales of around €718 million. We have close ties with our industry sectors and serve our customers’ business interests efficiently within the framework of our Fairs & Events, Locations and Services business fields. One of the Group’s key USPs is its closely knit global sales network, which extends throughout the world. Our comprehensive range of services – both onsite and online – ensures that customers worldwide enjoy consistently high quality and flexibility when planning, organising and running their events. The wide range of services includes renting exhibition grounds, trade fair construction and marketing, personnel and food services. Headquartered in Frankfurt am Main, the company is owned by the City of Frankfurt (60 percent) and the State of Hesse (40 percent).
For more information, please visit our website at:

We use cookies in order to constantly improve and optimize the design of our website. By continuing to use the website, you agree to the use of cookies. Further information may be found in the cookie section of our privacy policy.