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SMT Hybrid Packaging 2018 – solution-oriented initiator

Jun 7, 2018

After an intensive three days, the SMT Hybrid Packaging event can look back at a successful exhibition and conference on system integration in microelectronics. 434 exhibitors presented their solutions on 26,400 m²; these reflected all the technical processes involved in the production of electronic assemblies.

“The SMT Hybrid Packaging event is extremely important for us at Fuji Europe Corporation: Here we can maintain and develop contacts in central Europe, which is our main sales region. I would actually claim that if you aren’t here, you aren’t very successful on the market,” confirmed Stefan Janssen, Assistant General Manager, FUJI EUROPE CORPORATION GmbH, exhibitor at the SMT Hybrid Packaging 2018.

Around 12,000 visitors from around the world were able to gain an excellent overview of the entire value chain and network within the industry. Visitor highlights included the "Future Packaging" production line for "Smart Motion - Intelligent Automation for E-Mobility and Robotics" as well as the IPC Hand Soldering Competition, in which not only professionals but also young professionals were able to participate for the first time.

The conference and tutorials once again provided the 203 participants with numerous solution-oriented training opportunities and enabled direct dialogue with experts.

Established event with new name in 2019

From 2019, the event will undergo a name change. SMT Hybrid Packaging will become SMTconnect: solutions for electronic assemblies and systems.

The new event name describes the core of the event in thereby reflecting its clear focus. SMTconnect will bring together people and technologies from the areas of development, production, services and application of microelectronic assemblies and systems, creating important and valuable connections.

"The solution-oriented event provides the community with optimal conditions to exchange knowledge and ideas as well as jointly master the current challenges in microelectronics," explains Anthula Parashoudi, responsible division manager at Mesago Messe Frankfurt GmbH.

In addition, SMTconnect aims to bring more developable subjects into focus. In 2019, the topic of "Electronic Manufacturing Services" will be added to the portfolio.

The SMTconnect will be taking place in Nuremberg from 7 – 9 May 2019.

Up-to-date event information is available at

About Mesago Messe Frankfurt
Mesago Messe Frankfurt GmbH, founded in 1982 and located in Stuttgart, specializes in exhibitions and conferences on various topics of technology. The company belongs to the Messe Frankfurt Group. Mesago operates internationally and is not tied to a specific venue. With 140 members of staff Mesago organizes events for the benefit of more than 3,300 exhibitors and over 110,000 trade visitors, conference delegates and speakers from all over the world. Numerous trade associations, publishing houses, scientific institutes and universities work with Mesago closely as advisers, co-organizers and partners

Background information on Messe Frankfurt
Messe Frankfurt is the world’s largest trade fair, congress and event organiser with its own exhibition grounds. With over 2,500* employees at some 30 locations, the company generates annual sales of around €661* million. Thanks to its far-reaching ties with the relevant sectors and to its international sales network, the Group looks after the business interests of its customers effectively. A comprehensive range of services – both onsite and online – ensures that customers worldwide enjoy consistently high quality and flexibility when planning, organising and running their events. The wide range of services includes renting exhibition grounds, trade fair construction and marketing, personnel and food services. With its headquarters in Frankfurt am Main, the company is owned by the City of Frankfurt (60 percent) and the State of Hesse (40 percent). * Preliminary figures for 2017

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