With the demand for wide bandgap technologies, participants can look forward to extensive coverage of new GaN device designs including smart driving concepts, improved electrical-, thermal- and reliability-data for SiC components and innovative system designs that manage ultrafast switches in power converters. International experts from industry and academia will demonstrate several solutions on the system level as well as showcase the handling of extremely high di/dt’s and dv/dt’s inside the package. Talks will include:
- “Highly-Efficient MHz-Class Operation of Boost DC-DC Converters by Using GaN Transistors on GaN with Reduced RonQoss”, Shinji Ujita et al, Panasonic, Japan
- “A 3.3kV 1000A High Power Density SiC Power Module with Sintered Copper Die Attach Technology”, Kan Yasui, Hitachi Power Semiconductor Device et al, Japan
- “Challenging the 2D-Short Circuit Detection Method for SiC MOSFETs”, Patrick Hofstetter et al, University of Bayreuth, Germany
In addition, interested participants can learn about the benefits of wide bandgap devices in system designs with advanced passive components. Also at this year’s PCIM, new ferrite materials for the next generation of power supplies and filters for motor controls will be discussed in oral and poster presentations.
Discussions will further center on the future development potential for Si based devices, which will remain the key devices for most of high volume system application at least in the next two decades. As Professor Leo Lorenz, General Conference Director of PCIM Europe notes, the event will outline new developments on the next generation Si devices with outstanding electrical performance optimized for particular applications.
Heading into the future with practice-oriented topics
Also on the agenda at the PCIM Europe Conference is the hot topic of high reliable embedded power integrated modules achieving outstanding power densities. These relate to the development of new chip contacting technologies with a significant increase in the number of power cycles as well as advanced materials for elevated heat transfer and high isolation property. To achieve this target, the coefficient of thermal extension for all materials used inside the packages including the chip has to be matched. High-level experts will be providing specialist knowledge in the following sessions:
- “GaN Micro-Heater Chip for Power Cycling of Die Attach Modules with Ag Sinter Joint and High Temperature Solder”, Dongjin Kim, University of Osaka et al, Japan
- “Low Inductive SiC Mold Module with Direct Cooling”, Christoph Marczok et al, Fraunhofer Institute IZM, Germany
- “Redundant Liquid Cooled SiC Inverter with Highest Power-to-Weight Ratio for Electrical Drive Applications”, Stefan Pfefferlein et al, Siemens, Germany
All contributions are of high relevance to system design engineers. PCIM Europe Conference 2019 will trigger a new research area on high reliable packaging technologies for elevated temperatures with unlimited switching properties for the future development of power converters. As one of the highlights, Conference attendees can learn about the smart embedded power module consisting of ultrafast switches with an innovative integrated cooling system including the bus bar with RF damping on the switching cell directly and DC link capacitor. In addition, four extraordinary Special Sessions will deal with system development trends: “Technologies for DC Grids”, “Smart Functions in Power Electronics”, “Safety in Motion” and “Smart Transformers”.
"This year’s PCIM Europe Conference will be offering outstanding presentations covering three main elements of power electronic developments: wide bandgap technologies – devices and system design, highly reliable embedded power packaging technologies with excellent isolation and thermal performance including the management of ultrafast switching devices, and thirdly, future system development aspects for DC power grid including solid state power transformation,” summarizes Professor Leo Lorenz, General Conference Director of PCIM Europe.
Registration at attractive early bird prices
Registration for the PCIM Europe conference is possible at pcim-europe.com/registration. Attractive early bird prices will apply until 14 March 2019. Further information on the Conference program and a current list of exhibitors at the parallel exhibition are available online at pcim-europe.com.
About Mesago Messe Frankfurt
Mesago, founded in 1982 and located in Stuttgart, specializes in exhibitions and conferences on various topics of technology. The company belongs to the Messe Frankfurt Group. Mesago operates internationally and is not tied to a specific venue. With 140 members of staff Mesago organizes events for the benefit of more than 3,300 exhibitors and over 110,000 trade visitors, conference delegates and speakers from all over the world. Numerous trade associations, publishing houses, scientific institutes and universities work with Mesago closely as advisers, co-organizers and partners. (mesago.com)
Background information on Messe Frankfurt
Messe Frankfurt is the world’s largest trade fair, congress and event organiser with its own exhibition grounds. With more than 2,500* employees at 30 locations, the company generates annual sales of around €715* million. Thanks to its far-reaching ties with the relevant sectors and to its international sales network, the Group looks after the business interests of its customers effectively. A comprehensive range of services – both onsite and online – ensures that customers worldwide enjoy consistently high quality and flexibility when planning, organising and running their events. The wide range of services includes renting exhibition grounds, trade fair construction and marketing, personnel and food services. With its headquarters in Frankfurt am Main, the company is owned by the City of Frankfurt (60 percent) and the State of Hesse (40 percent). For more information, please visit our website at: www.messefrankfurt.com
*preliminary figures 2018